Solder paste (gray glue)

Solder paste is mixed with tin powder, flux, other surfactants, thixotropic agents, etc. to form a paste-like mixture.

Particle size: T2 (diameter 45-75 μm ), T3 (diameter 25-45 μm ), T4 (diameter 20-38 μm ), T5 (diameter 15-25 μm ) , T6 ( diameter 5-1 5μm )

Alloy composition: The recommended ingredients are consistent with the welding tape composition. Sn63Pb37 and Sn60Pb40 are conventionally used; Sn43Pb43Bi14 and Sn42Bi58 are used in low temperatures;

Product Application

1. Suitable for BC component products: Optimize solder paste formula to meet the connection of back electrode welding and improve product reliability.

2. Battery chip stacking welding: The electrical connection between the battery stacks is achieved by low-temperature curing solder paste, reducing the damage to the battery structure by high temperature.

3. Terminal box and bus bar packaging: participates in the connection between diodes and wires inside the junction box, and high fatigue resistance and moisture resistance solder paste ensures the reliability of the long-term outdoor operation of the component; it is used for multi-point welding of photovoltaic module bus bars, which requires high conductivity and mechanical strength to avoid cracking of solder joints due to thermal expansion and contraction.

other

1. Under unopened storage conditions of 0~10℃, the validity period is 6 months;

2. Use within 24 hours after the packaging is sealed ;

3. The solder paste can be placed on the printing press for 6-8 hours;

4. Do not add used solder paste to unused solder paste. Used solder paste should be stored separately;

5. Use an inner plug or end cap to seal the unused paste.